Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, China, Ireland, Japan, Singapore, Taiwan, Thailand, and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer backgrinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip interconnect technologies; and leadframe and substrate package carriers are used for various testing services. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; flip chip ball grid array (BGA) products for various networking, storage, computing, and consumer applications; and flip chip molded BGA packages that enable thinner packaging and thermal performance. In addition, it offers leadframe packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages that are used to connect a die to a substrate; micro-electro-mechanical systems packages, a miniaturized mechanical and electro-mechanical sensor; and system-in-package modules, which are used in mobile devices and other applications for components, such as fingerprint sensors, radio frequency controllers, power amplifiers, GPS modules, Bluetooth modules, digital basebands, and hard drive controllers. The company primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries, as well as communications, consumer, networking, computing, and automotive and industrial markets. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.