Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. It offers package formats and services using wirebonding and flip chip interconnect technologies that connect the die to the package carrier. The company’s package carriers include leadframe packages that utilize metal and place the electrical interconnect leads to the system board around the perimeter of the package; substrate packages, which utilize a laminate as the package carrier; and wafer-level packages. It provides chip scale packages comprising stacked chip scale packages for chipsets and memory applications; package-on-package solutions for the integration of logic and memory in a single footprint; and system-in-package modules that integrate two or more chips and passive device elements into a single package. The company also offers ball grid array packages comprising flip chip ball grid array packages that are used with silicon nodes for small devices and other applications; and plastic ball grid array packages, which use wirebond technology. In addition, it provides other packaging services, such as wafer bumping services. Further, the company offers semiconductor testing services, including wafer testing or probe, final testing, strip testing, and end-of-line test services; and specialized logistical services, such as security certification and anti-counterfeit measures. It primarily serves the communications, consumer, computing, networking, automotive, and industrial markets. Amkor Technology, Inc. was founded in 1968 and is headquartered in Chandler, Arizona.