Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices, including integrated circuits, discrete devices, light-emitting diodes (LED), and power modules. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; wafer level bonders, which mechanically applies bumps to dies for some variants of the flip chip assembly process; heavy wire wedge bonders to connect semiconductor chips for the power packages, power hybrids, and automotive modules; and manual wire bonders, as well as offers spare parts, equipment repair, and training services. The Expendable Tools segment provides various expendable tools for a range of semiconductor packaging applications. This segment’s products include capillaries for use in ball bonders, as well as gold wire bonding; bonding wedges for use in heavy wire wedge bonders; dicing blades that are used for cutting silicon wafers into individual semiconductor dies; and copper wire bonding capillaries. The company also services, maintains, repairs, and upgrades its equipment. It serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.