Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services to semiconductor suppliers worldwide. Its packaging and testing solutions include substrate packages and lead-frame packages, as well as testing for logic, mixed signal, and embedded memory devices to measure and ensure the performance, functionality, and reliability of packaged semiconductor devices. The company also offers a turnkey service from packaging and testing to shipment. Its substrate packages category employs the ball grid array design, which utilizes a laminated substrate rather than a lead-frame and places the electrical connections on the bottom of the package rather than around the perimeter; and lead-frame packages are characterized by a semiconductor chip encapsulated in a plastic molding compound with metal leads on the perimeter. The company’s testing services include wafer probing that involves sorting the processed wafer for defects to ensure that it meets customer acceptance criteria; final testing services; change kit and socket design services; and other testing services comprising system-level testing, lead/ball scanner, marking, and tape and reel services. It serves customers in personal computer, communications, and consumer integrated circuits, as well as non-commodity memory semiconductor markets. Siliconware Precision Industries Co., Ltd. was founded in 1984 and is headquartered in Taichung, Taiwan.